Surface and Thin Film Techniques | Materials Characterization Services

Below is a list of Surface and Thin Film Techniques available from Materials Characterization Services. Click on any hyperlinked technique to learn more about it.

Surface and Thin Film Techniques
3-D Surface Profiling
3-Omega Thermal Conductivity
Adhesion
AFM - Atomic Force Microscopy
AES - Auger Electron Spectroscopy
Contact Angle Measurement
EBSD - Electron BackScatter Diffraction
ESCA - Electron Spectroscopy for Chemical Analysis
Ellipsometry
EXAFS - Extended X-ray Absorption Fine Structure
Hardness Testing
HFS - Hydrogen Forward Scattering
ISS - Ion Scattering Spectroscopy
LA-ICPMS - Laser Ablation Inductively Coupled Plasma Mass Spectrometry
MicroHardness
Nanoindentation
NRA - Nuclear Reaction Analysis
PIXE - Particle Induced X-Ray Emission
PALS - Positron Annihilation Lifetime Spectroscopy
Profilometry (Contact and Non-Contact)
RBS - Rutherford Backscattering Spectrometry
SPM - Scanning Probe Microscopy
SIMS - Secondary Ion Mass Spectrometry
Surface Roughness/Flatness
TDS - Thermal Desorption Spectrometry
TDTR - Time Domain ThermoReflectance
TOF-SIMS – Time-of-Flight Secondary Ion Mass Spectrometry
TXRF - Total Reflection X-ray Fluorescence
Tribology
UPS- Ultraviolet Photoelectron Spectroscopy
VPD-ICPMS - Vapor Phase Decomposition/ICPMS
Wafer Bow
Wear & Friction
XRD - X-ray Diffraction
XRF - X-ray Fluorescence
XPS – X-ray Photoelectron Spectroscopy
XXR - X-ray Reflectivity